• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In a printed circuit board (1) at least comprising an insulating layer (2) and a conductive layer (FIG. 2) arranged on the insulating layer (2) and structured to form a contact surface (4) for an electronic component (11) to be fitted to the printed circuit board (1). 3), the circuit board (1) in the region of the contact surface (4) at least one, the contact surface (4) and the insulating layer (2) passing through channel (8), which is filled with a thermally conductive material. The method is characterized by the steps of providing an insulating layer (2) and a conductive layer (3) connected to the insulating layer (2), producing at least one channel (8) passing through the conductive (2) and the insulating layer (3). , Lining the channel (8) with thermally conductive material, structuring the conductive layer (3) to a contact surface (4) for an electronic component (11) to be equipped, providing a solder deposit (9) in at least minimal overlap with the contact surface (4) , Setting the electronic component (11), melting the solder and cooling off.
    公开号:AT517203A4
    申请号:T50581/2015
    申请日:2015-07-06
    公开日:2016-12-15
    发明作者:Edlinger Erik；Kieslinger Dietmar
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    Printed circuit board and method for producing a printed circuit board
    The invention relates to a printed circuit board comprising at least an insulating layer and a conductive layer arranged on the insulating layer and structured to form a contact surface for an electronic component to be fitted to the printed circuit board, and to a method for producing a printed circuit board.
    Circuit boards are known in the art as printed circuit boards or printed wiring boards and serve electrical, but above all electronic components to save space and stable to connect with each other. For this purpose, printed circuit boards have insulating layers arranged on conductive layers, which are structured to interconnect the components to strip conductors and are separated from each other by the insulating layers. The components may in this case be arranged on the surface of the printed circuit board or embedded in the printed circuit board. The progressive miniaturization of printed circuit boards for providing a large number of functionalities in small-sized devices leads to not inconsiderable constraints on the dissipation of heat released from the components and efficiently dissipated and radiated both to protect the components and to protect the printed circuit board got to. Particularly problematic are components that give off a lot of heat and so require, for example, power transistors and LEDs (light-emitting diodes), which are increasingly used in vehicle construction, a well-thought-out thermal management of the circuit board to avoid overheating and concomitant damage to the circuit boards.
    In the prior art it is known in this context to provide heat dissipation surfaces in the immediate vicinity of electronic components. Heat spreader surfaces are copper layers or even small metal plates that are capable of absorbing the heat emitted by the component and radiating over a larger area than that of the component. A disadvantage of such structures, however, is that they require a relatively large amount of space, which is no longer available due to the conductive nature of the heat spreader surfaces for the arrangement of printed conductors.
    The invention is therefore based on the object to provide a printed circuit board, which has an improved thermal management.
    To solve this problem, the circuit board of the aforementioned type according to the invention is characterized in that the circuit board in the region of the contact surface has at least one contact surface and the insulating layer passing through channel, which is filled with a thermally conductive material. In the context of the present invention, a channel is to be understood as a recess in the printed circuit board, which has a considerable horizontal extent in the plane of the printed circuit board, in contrast to a simple bore or to a well. Therefore, such a channel has similarities with a slot and the horizontal extent of the channel serves on the one hand to provide as large a mass of metal for receiving heat emitted by the component and on the other hand, the heat horizontally wegschleiten in the plane of the circuit board of the component the heat can be radiated in a remote from the component region of the circuit board.
    By passing through the contact surface and the insulating layer of the printed circuit board according to the present invention and filling with a thermally conductive material, which thermally conductive material is usually a metal, the heat of the component may not only be horizontal, i. in the plane of the printed circuit board, are led away from the component, but it is simultaneously conducted to the other side of the insulating layer and can be additionally radiated there. Unlike simple vias, a channel according to the invention in the printed circuit board can be dimensioned according to the actual or expected amounts of heat emitted by a component, so that a targeted thermal management for the respective printed circuit board can be realized.
    According to a preferred embodiment, the printed circuit board according to the invention is further developed in that the printed circuit board in the region of the contact surface has a plurality of the contact surface and the insulating layer passing through channels, which are filled with a thermally conductive material. While it may be sufficient in accordance with the present invention to provide only one channel as described above, it is preferred to increase the efficiency of dissipating heat away from the component while still making the most efficient use of the space available on a printed circuit board Assign contact surface, which per contact surface a possibly large metal mass can be introduced into the circuit board without disturbing the continuous structure of the insulating layer of the circuit board, which contributes to a significant extent to the mechanical stability of the circuit board by a too bulky channel and thereby weaknesses. At the same time, the provision of a plurality of channels per contact surface achieves a more even distribution of the heat on the printed circuit board, which in turn counteracts the formation of temperature peaks and, consequently, stresses and consequently weakening of the printed circuit board.
    As already mentioned, an advantage of the invention is that a channel, as described and defined above, penetrates the contact surface and the insulating layer of the printed circuit board according to the invention, so that the heat can also be radiated on the side opposite the component. In this context, it is preferred if the contact surface is guided along the channels to the other side of the insulating layer. This means that the contact surface for the component is arranged not only on that side of the component which also carries the component which gives off the heat, but rather that the contact surface is formed symmetrically on both sides of the printed circuit board or on both sides of the insulating layer of the component Printed circuit board is formed so that the heat is brought by the at least one channel not only on the other side of the circuit board, but there also can be distributed over the surface depending on the dimensions of the contact surface and is emitted correspondingly efficient.
    The vast majority of electrical and electronic components are contacted with a plurality, for example, two or three, contact surfaces of the same conductive layer, so that it appears advantageous in the context of the present invention, when the conductive layer to a plurality of contact surfaces for a the printed circuit board is structured to be populated electronic component and at least one of the contact surface and the insulating layer passing through channel is provided for at least one of the plurality of contact surfaces. The previously described for only one contact surface arrangement of the contact surface and the insulating layer passing through channels can therefore also be used for a plurality of contact surfaces for one and the same compo nent or for a plurality of contact surfaces for different components, which in turn the derivation of Heat of the respective component is beneficial.
    A further improvement of the heat radiation of the component is achieved when the contact surface is designed as a heat spreader surface. This means that the contact surface for the component to be assembled is formed with a surface that substantially exceeds the area actually required for contacting the component, so that not only the electrical connection of the component is achieved by the dimensioning of the contact surface, but due to the much larger Execution also a horizontal distribution of the heat emitted by the component is possible.
    According to a preferred embodiment of the present invention, it may be provided that the at least one channel extends beyond the region of the contact surface. Whether the contact surface is dimensioned as a simple contact surface and therefore essentially with that surface area which corresponds to the contacts of the component to be assembled, or whether the contact surface is designed as a heat-dissipating surface, i. with an area substantially larger than the area required to populate or contact the component, the channels of the present invention described above may be dimensioned in such a way and in particular such a horizontal extent, i. such an extent in the plane of the circuit board have that the channel extends beyond the region of the contact surface or the heat spreader surface and therefore the heat of the component can be arbitrarily far away from the component, as long as the channel, as mentioned above, as a rule filled with metal, no traces crossed and above all, no traces of the circuit board short-circuits.
    A number of materials, and in particular metals, are suitable for backfilling the channel passing through the contact surface and the insulating layer. A high thermal conductivity is assumed for copper, silver and gold, whereby copper can be electrodeposited. However, it is provided according to a preferred embodiment of the present invention that the heat-conductive material is selected from the group consisting of a solder, in particular SAC solder, silver nanopast, thermal adhesive and thermal
    Interface material. The filling of the contact surface and the insulating layer passing through channel with a solder is therefore advantageous, since in this case the placement of the component on the circuit board, which is usually done by soldering, in a common process step with the filling of at least a channel can be executed. Particularly advantageous for soldering and at the same time as a particularly thermally conductive SAC solder has been found, which is a solder containing the components tin, silver and copper. The aforementioned silver nanopaste is available under the name "Inkron The Attach Material IDA-22" and is characterized by a high thermal conductivity.The silver nanopast can be applied by means of jet-dispensing or stencil printing.A thermal interface material is for example "DOW Corning® TC-4025 Dispensable Thermal Pad "or" Tpcm® 200sp ".
    The invention has hitherto been described in terms of the minimum requirement of a printed circuit board which is intended to fall under the scope of protection of the printed circuit board as defined in the claims. However, the invention can also be realized with multilayer printed circuit boards, so that the printed circuit board according to the invention preferably comprises a plurality of insulating layers and conductive layers. Here, the insulating and conductive layers, as described and defined so far, can be processed into contact surfaces and channels that pass through the contact surfaces and the insulating layers and are filled with a heat-conducting material. However, the insulating layers and the conductive layers may also be layers that correspond to a conventional structure of a printed circuit board and generally serve the interconnection of electronic components. The inventive arrangement of at least one channel, which passes through a contact surface and an insulating layer, can therefore be used in combination with multilayer printed circuit boards. The channel can therefore pass through the entire multi-layer printed circuit board or ends perpendicular to the printed circuit board surface on an intermediate layer, in particular on a heat-conducting layer.
    According to a preferred embodiment, it is provided that the at least one channel is terminated on one side of the printed circuit board with an insulating layer, in which case the channel according to the present invention can also be addressed as a trench.
    The present invention is primarily used to dissipate heat that is emitted by electronic, but also by electrical components on a printed circuit board, which is why the present invention preferably further developed in that the circuit board with an electronic component, in particular an LED, a laser diode and / or an SMD component is populated. LEDs are increasingly being used, especially in vehicle manufacturing, for the production of powerful headlight units, these LEDs emitting extremely large amounts of heat and efficient dissipation of the heat to protect the printed circuit board being of essential importance. The same applies to laser diodes, which are also increasingly gaining importance as illuminants for vehicle headlights. The present invention can make an excellent contribution here and therefore be used with the greatest possible benefit.
    The method according to the invention for producing a printed circuit board, as just defined, is characterized by the following steps:
    Providing an insulating layer and a conductive layer connected to the insulating layer,
    Producing at least one channel passing through the conductive and the insulating layer,
    Lining the channel with thermally conductive material,
    Patterning the conductive layer into a contact surface for an electronic component to be populated,
    Providing a solder deposit in at least minimal overlap with the contact surfaces,
    Placing the electronic component,
    Melting the solder and cooling.
    The provision of an insulating layer having an overlying conductive layer is accomplished by methods well known to those skilled in the printed circuit board art. These include lamination methods. As a result, the conductive and insulating layers are processed by any convenient method to produce at least one channel passing through these layers. These methods include in particular drilling and milling as well as laser cutting processes. Subsequently, the channel is lined with a thermally conductive material, for example, the side surface and possibly the bottom surface of the channel are covered by electrodeposition of Cu metal. In this processing state, the conductive layer is patterned at the top to a contact surface for an electronic component to be loaded. For this purpose, for example. Photolithographic process, as are customary for the production of printed conductors and contact surfaces used. Subsequently, a solder deposit, i. an accurately measured amount of solid solder, at least minimally overlapping the contact surface (s) provided for contacting the component, and disposing the electronic component in the region above the contact surface, the electronic component at the Can support solder deposit. The solder deposit contains paste-like portions that can be printed, and optionally in addition solid portions such as Lötklötzchen that can be equipped. A partial overlap of the solder deposits with the contact surfaces is advantageous in that excess flux can escape in the areas where no wetting is present without disturbing the flow of the solder into the desired areas. There is a melting of the solder by increasing the temperature in the environment of the component, whereby the solder deposit with simultaneous outgassing of a possibly applied flux in the region of the channels and the contact surfaces by capillary forces and by gravity in the region of at least one channel penetrates and at corresponding Dimensioning the Lotmenge simultaneously filling the at least one channel and contacting the component takes place.
    In accordance with a preferred embodiment of the present invention, prior to the step of providing a solder deposit, a solder resist is deposited leaving portions of the contact area exposed for contacting the electronic component. This optional step serves to allow the later molten solder, which is formed in a subsequent step, to penetrate only into those areas which are not covered with the solder resist, so that an undesirable distribution of solder is avoided. For this purpose, the solder resist can be applied a priori omission of a corresponding area or the solder resist is applied over the entire surface and then made the exemption. The excluded areas also include the channels.
    According to a preferred embodiment of the method according to the invention, before the step of providing a solder deposit, the at least one channel with a thermally conductive material, in particular a thermally conductive material selected from the group consisting of a solder, in particular SAC solder, silver nanopast, thermal adhesive and thermal interface Material filled. In this case, the filling of the channels and the soldering of the component is not simultaneous, but a greater freedom of design with respect to the filling material for the channels is achieved.
    As already mentioned in connection with the printed circuit board according to the invention, a plurality of channels penetrating the contact surface and the insulating layer may be produced, in order to achieve a corresponding improvement in the dissipation of heat emitted by the component. While it may be sufficient in accordance with the present invention to provide only one channel as described above, it is preferred to increase the efficiency of dissipating heat away from the component while still making the most efficient use of the space available on a printed circuit board Assign contact surface, which per contact surface a possibly large metal mass can be introduced into the circuit board without disturbing the continuous structure of the insulating layer of the circuit board, which contributes to a significant extent to the mechanical stability of the circuit board by a too bulky channel and thereby weaknesses. At the same time, the provision of a plurality of channels per contact surface achieves a more even distribution of the heat on the printed circuit board, which in turn counteracts the formation of temperature peaks and, consequently, stresses and consequently weakening of the printed circuit board.
    Likewise, it can preferably be provided that the conductive layer is structured to form a plurality of contact surfaces for an electronic component to be fitted to the printed circuit board and at least one channel which penetrates the contact surface and the insulating layer is produced for at least one of the plurality of contact surfaces.
    According to a preferred embodiment of the present invention, the at least one channel is pulled beyond the area of the contact surface. Whether the contact surface is dimensioned as a simple contact surface and therefore essentially with that surface area which corresponds to the contacts of the component to be assembled, or whether the contact surface is designed as a heat-dissipating surface, i. with an area substantially larger than the area required to populate or contact the component, the channels of the present invention described above may be dimensioned in such a way and in particular such a horizontal extent, i. such an extent in the plane of the circuit board have that the channel extends beyond the region of the contact surface or the heat spreader surface and therefore the heat of the component can be arbitrarily far away from the component, as long as the channel, as mentioned above, as a rule filled with metal, no traces crossed and above all, no traces of the circuit board short-circuits.
    The solder deposit consists of SAC solder according to a preferred embodiment of the present invention. The filling of the contact surface and the insulating layer passing through channel with a solder is therefore advantageous, since in this case the placement of the component on the circuit board, which is usually done by soldering, in a common process step with the filling of at least a channel can be executed. Particularly advantageous for soldering and at the same time as a particularly thermally conductive SAC solder has been found, which is a solder containing the components tin, silver and copper.
    The invention will be explained in more detail with reference to an embodiment schematically illustrated in the drawing. In this show
    1a is a schematic plan view of an intermediate product in the manufacture of a printed circuit board according to the invention,
    1 b is a cross-section according to the dotted line of Fig. La by said intermediate product,
    2 shows a perspective view, partly in section, of an intermediate product according to FIGS. 1a and 1b,
    3 shows an intermediate product in the production of a printed circuit board according to the invention, in which solder deposits and a component have already been placed, and FIGS. 4a and 4b show a plan view after melting the solder and a section after the solder has melted.
    In Fig. La a circuit board according to the invention is designated by the reference numeral 1. The circuit board consists essentially of an insulating layer 2 and a conductive layer 3, which is structured to form conductor tracks and contact surfaces 4 for a component to be assembled. The contact surfaces 4 are shown in Fig. La with dashed lines, since their outline edges are hidden under Lötstopplack 5 and only necessary for the Ankontaktierung a component contact areas 6 of the contact surfaces 4 are directly visible. In Fig. La, therefore, the contact surfaces 4 are designed for the component to be equipped as heat spreader surfaces, since their surface is substantially larger than that area which would be necessary for pure electrical contacting of the component. The Lötstopplack 5 is applied with the release of a recess 7 to release the contact surfaces 6 for contacting the component. The channels passing through the contact surface 4 and the insulating layer 2 are designated by 8 and can be produced by processes as described above.
    1a shows in section the situation of FIG. 1a and it can be seen that the contact surface 4 is guided along the channels 8 to the other side of the insulating layer 2 and is arranged symmetrically there. The channels 8 pass through both the contact surface 4 and the insulating layer 2 and are, as already mentioned, in Fig. La and lb not yet filled with the heat-conducting material, in particular the metal.
    In Fig. 2 it can be seen again that the insulating layer 2 and the overlying contact surface 4 are covered in this intermediate product from Lötstopplack 5, but as the contact surface 4 and the insulating layer 2 is already interspersed to form the channels 8. 2 'denotes an insulating layer which can be applied as an additional insulating layer on the printed circuit board assembly according to the invention in order to terminate the channels 8 on the side opposite the component.
    In Fig. 3 now Lotdepots 9 are provided on the Lötstopplack 5 next to the recess 7, wherein arrows 10 indicate that with a corresponding increase in temperature and concomitantly melting the solder deposits 9, the liquefied solder flows into the channels 8 and 6 in the contact area , The electronic component 11 is on the solder deposits 9 before melting the solder and is temporarily held by a glue dot 13. As a result, during the melting of the solder deposits 9, the component 11 is retained in its height and horizontal position with respect to the printed circuit board 1, so that the electronic component 11 is not lowered or floated. The contacting of the contact pads 12 of the electronic component 11 by the solder from the solder deposits 9 is ensured by the fact that in the print layout of the printed circuit board 1, an at least minimal overlap between the solder deposit 9 and the contact areas 6 on the circuit board 1 and the contact pads 12 of the electronic component 11 is provided and the distance between the contact pads 10 and the contact region 6 of the contact surfaces 4 is relatively small, so that it comes to capillary between the contact pads 12 and the contact region 6, and the solder is pulled from the solder deposits 9 in these areas to the contact pads.
    In Fig. 4a, the situation after the melting of the circuit board is shown, but for better view of the channels 8, the electronic component 11 is not shown. In FIG. 4 a, it can be seen that both the channels 8 and the contact regions 6 are completely filled with solder and the heat emitted by the component 11 is therefore distributed over the entire region of the contact surface 4 designed as a heat spreading surface for the component 11 to be assembled can, in particular from Fig. 4b shows that a large volume of metal and therefore a large metal mass in the channels 8 can be provided so that the heat absorbed by the component 11 dissipated in this metal mass and in particular on the other side of the circuit board 1 can be brought. In this way, it is possible to distribute and dissipate even large amounts of heat from electronic components such as LEDs, so that in the printed circuit board according to the invention a lower punctual loading of the circuit board as well as the component 11 results, resulting in a longer operating time and reliability of the circuit board to a large extent is beneficial.
    权利要求:
    Claims (17)
    [1]
    claims
    1. printed circuit board (1) at least comprising an insulating layer (2) and a conductive layer (FIG. 2) arranged on the insulating layer (2) and structured to form a contact surface (4) for an electronic component (11) to be populated on the printed circuit board (1) 3), characterized in that the printed circuit board (1) in the region of the contact surface (4) at least one the contact surface (4) and the insulating layer (2) passing through channel (8) which is filled with a thermally conductive material.
    [2]
    2. Printed circuit board according to claim 1, characterized in that the circuit board (1) in the region of the contact surface (4) has a plurality of the contact surface (4) and the insulating layer (2) passing through channels (8), which with a thermally conductive material are filled.
    [3]
    3. Printed circuit board according to claim 1 or 2, characterized in that the contact surface (4) along the channels (8) on the other side of the insulating layer (2) is guided.
    [4]
    4. Printed circuit board according to one of claims 1 to 3, characterized in that the conductive layer (3) to a plurality of contact surfaces (4) for an on the printed circuit board (1) to be populated electronic component (11) is structured and at least one the plurality of contact surfaces (4) at least one of the contact surface (4) and the insulating layer (2) passing through channel (8) is provided.
    [5]
    5. Printed circuit board according to one of claims 1 to 4, characterized in that the contact surface (4) is designed as a heat spreading surface.
    [6]
    6. Printed circuit board according to one of claims 1 to 5, characterized in that the at least one channel (8) extends beyond the region of the contact surface (4) also.
    [7]
    7. Printed circuit board according to one of claims 1 to 6, characterized in that the heat-conducting material is selected from the group consisting of a solder, in particular SAC solder, silver nanopaste, thermal adhesive and thermal interface material.
    [8]
    8. Printed circuit board according to one of claims 1 to 7, characterized in that the printed circuit board (1) comprises a plurality of insulating layers (2,2 ') and conductive layers (3).
    [9]
    9. Printed circuit board according to one of claims 1 to 8, characterized in that the at least one channel (8) on one side of the printed circuit board (1) with an insulating layer (2 ') is completed.
    [10]
    10. Printed circuit board according to one of claims 1 to 9, characterized in that the printed circuit board (1) with an electronic component (11), in particular an LED, a laser diode and / or an SMD component is fitted.
    [11]
    11. A method for producing a printed circuit board according to claim 10, characterized by at least the steps of providing an insulating layer (2) and a conductive layer (3) connected to the insulating layer (2) producing at least one of the conductive (3) and insulating layers Layer (2) passing channel (8) lining the at least one channel (8) with thermally conductive material structuring the conductive layer (3) to a contact surface (4) for an electronic component to be loaded (11) providing a solder deposit (9) in at least minimal overlap with the contact surface (4), placement of the electronic component (11), melting of the solder and cooling.
    [12]
    12. The method according to claim 11, characterized in that prior to the step of providing a solder deposit a solder resist with the release of areas of the contact surface, which serve to contact the electronic component, is applied.
    [13]
    13. The method according to claim 11 or 12, characterized in that prior to the step of providing a solder deposit the at least one channel (8) with a heat-conducting material, in particular a thermally conductive material selected from the group consisting of a solder, in particular SAC solder, Silver nanopaste, thermal adhesive and thermal interface material is filled.
    [14]
    14. The method according to any one of claims 11 to 13, characterized in that a plurality of the contact surface (4) and the insulating layer (2) passing through channels (8) is produced.
    [15]
    15. The method according to any one of claims 11 to 14, characterized in that the conductive layer (3) to a plurality of contact surfaces (4) for an on the circuit board (1) to be populated electronic component (11) is structured and at least one the plurality of contact surfaces (4) at least one of the contact surface (4) and the insulating layer (2) passing through channel (8) is produced.
    [16]
    16. The method according to any one of claims 1 to 15, characterized in that the at least one channel (8) over the region of the contact surface (4) is pulled out.
    [17]
    17. The method according to any one of claims 11 to 16, characterized in that the solder deposit (9) consists of SAC solder.
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50581/2015A|AT517203B1|2015-07-06|2015-07-06|Printed circuit board and method for producing a printed circuit board|ATA50581/2015A| AT517203B1|2015-07-06|2015-07-06|Printed circuit board and method for producing a printed circuit board|
    EP16739391.7A| EP3320760B1|2015-07-06|2016-06-21|Printed circuit board and method for producing a printed circuit board|
    US15/741,585| US10327325B2|2015-07-06|2016-06-21|Printed circuit board and method for producing a printed circuit board|
    CN201680039954.0A| CN107852811B|2015-07-06|2016-06-21|Printed circuit board and method for manufacturing printed circuit board|
    PCT/AT2016/050215| WO2017004632A1|2015-07-06|2016-06-21|Printed circuit board and method for producing a printed circuit board|
    JP2018500501A| JP2018519672A|2015-07-06|2016-06-21|Circuit board and method for manufacturing the circuit board|
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